Type of Document	Thesis
Author	Shukla, Shishir
Author's Email Address	shishirshukla@yahoo.com
URN	etd-11242003-113245
Title	Optimization of Thickness of Energy Transfer Medium for Laser Particle Removal Process
Degree	Master of Science
Department	Industrial and Manufacturing Engineering, Department of
Advisory Committee	Advisor Name Title Hsu-Pin Wang Committee Chair
Keywords	laser assisted particle removal material science ETM shishir shukla Si material
Date of Defense	2003-11-01
Availability	unrestricted
Abstract The removal of particles, on the order of a micrometer – nanometer in size, adhered to surfaces poses a challenge to Integrated Circuit (IC) fabrication, space optics, high resolution and high power optics, large area displays, magnetic storage device and other critical surfaces. The existing cleaning processes are unable to clean particulate contamination at the sub-micron level. Laser Particle Removal (LPR) is a novel technique to remove micron and submicron particulate contamination from the solid surface. In LPR, a vapor of an Energy Transfer Medium (ETM) is condensed on the Si substrate. The vapor forms a uniform film on and around the particles. After a short time lag a KrF laser beam is used to irradiate the Si substrate which causes explosive evaporation of the ETM and propels the particle off the substrate. The ETM film thickness should be a critical factor in the LPR process. In our experiments a KrF laser at 248 nm is used to remove polystyrene particles of 0.1 ìm, 0.25 ìm and 0.55 ìm in radius from a Si substrate using 2-propanol as the ETM. The Cleaning threshold fluence for these particles at varying ETM film thicknesses is measured. In the end of this work the molecular dynamics simulations of laser cleaning process is discussed.
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